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Journal of The Japan Institute of Electronics Packaging

ISSNs: 1343-9677, 1884-121X
Source type: journal
Alternate names: Journal of Japan Institute of Electronics Packaging, Journal of the Japan Institute of Electronics Packaging, エレクトロニクス実装学会誌
Fully OA: No
DOAJ: No
OpenAlex ID: S66058762
Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.
2002 · Hisaaki TAKAO, Akira YAMADA, et al. · Journal of The Japan Institute of Electronics Packaging · 41
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FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules.
2000 · Yoshiyuki NAGATOMO, Toshiyuki NAGASE, et al. · Journal of The Japan Institute of Electronics Packaging · 28
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Convenient Debonding Strength Evaluation Based on the Intensity of Singular Stress for Adhesive Joints
2014 · Nao-Aki Noda, Tatsujiro Miyazaki, et al. · Journal of The Japan Institute of Electronics Packaging · 27
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Proposal and Investigation of Unbalanced Dipole Antenna with Semicircular and Trapezoidal Radiators for UWB Radio
2007 · Fukuro KOSHIJI, Toshiya EGUCHI, et al. · Journal of The Japan Institute of Electronics Packaging · 26
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Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Packages Taking into Consideration of Chemical Shrinkage of Molding Compound
2004 · Kiyoshi MIYAKE · Journal of The Japan Institute of Electronics Packaging · 26
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Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints
2004 · Hiroyuki TAKAHASHI, Takashi KAWAKAMI, et al. · Journal of The Japan Institute of Electronics Packaging · 24
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2003 · Yorishige MATSUBA · Journal of The Japan Institute of Electronics Packaging · 22
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2019 International Conference on Electronics Packaging
2019 · Journal of The Japan Institute of Electronics Packaging · 20
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New Chromium Free Pretreatment Method for Plating on ABS Resin Using TiO2 under UV Light Irradiation
2005 · Katsuhiko TASHIRO, Masaharu SUGIMOTO, et al. · Journal of The Japan Institute of Electronics Packaging · 19
A Super-Flexible Sensor System for Humanoid Robots and Related Applications
2008 · Masahiro Inoue, Yasushi Kawahito, et al. · Journal of The Japan Institute of Electronics Packaging · 18
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A New Flip-Chip Bonding Method Using Ultra-Precision Cutting of Metal/Adhesive Layers
2008 · Taiji Sakai, Seiki Sakuyama, et al. · Journal of The Japan Institute of Electronics Packaging · 18
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Debonding Criterion for Single Lap Joints from the Intensity of Singular Stress Field
2013 · Tatsujiro Miyazaki, Nao-Aki Noda, et al. · Journal of The Japan Institute of Electronics Packaging · 16
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2004 · Kazuhiro MURATA · Journal of The Japan Institute of Electronics Packaging · 16
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Formation of Integrated Circuit Interconnection Using Copper Electroplating.
2001 · Yuichi TAKADA, Kimiko OYAMADA, et al. · Journal of The Japan Institute of Electronics Packaging · 16
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Influence of Bath Composition to Via-Filling by Copper Electroplating.
2000 · Takeshi KOBAYASHI, Junichi KAWASAKI, et al. · Journal of The Japan Institute of Electronics Packaging · 16
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Surface Modification of Liquid Crystal Polymers Using UV Irradiation
2008 · Mitsuhiro WATANABE, Yosuke IIMORI, et al. · Journal of The Japan Institute of Electronics Packaging · 15
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Low-Temperature Bonding Technique Using Sub-Micron Au Particles
2007 · Toshinori OGASHIWA, Tadahiro SHIBUTANI, et al. · Journal of The Japan Institute of Electronics Packaging · 15
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Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder
2006 · Megumi NAGANO, Noboru HIDAKA, et al. · Journal of The Japan Institute of Electronics Packaging · 15
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2002 · Masaaki ODA · Journal of The Japan Institute of Electronics Packaging · 15
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Metallizing on Cyclo Olefin Polymer Film Using UV Irradiation as a Surface Modification
2010 · Kunihito Baba, Yoshiyuki Nishimura, et al. · Journal of The Japan Institute of Electronics Packaging · 14
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Smooth Circuit Formation on Cycloolefin Polymers
2007 · Mitsuhiro WATANABE, Kiichi MATSUI, et al. · Journal of The Japan Institute of Electronics Packaging · 14
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2007 · Ryo HARUTA · Journal of The Japan Institute of Electronics Packaging · 14
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Evaluation of Residual Stress in Semiconductor Chips during Resin-Molding Process Using Piezoresistive Test Chips and a Finite Element Analysis Method
2006 · Masaaki KOGANEMARU, Toru IKEDA, et al. · Journal of The Japan Institute of Electronics Packaging · 14
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Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure.
2002 · Keun-Soo KIM, Young-Sun KIM, et al. · Journal of The Japan Institute of Electronics Packaging · 13
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Influence of Additives on Via-Filling Using Copper Electroplating.
2002 · Shuhei MIURA, Kuniaki MIHARA, et al. · Journal of The Japan Institute of Electronics Packaging · 13
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Works count: 4,012
Citation count: 2,951
H-index: 15
I10-index: 43
2yr mean citedness: 0.055
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