Work

Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials

Year: 2015

Type: conference-paper

Abstract: The near-tip fields of an anti-plane crack in functionally graded piezoelectric materials(FGPMs) are investigated.To make the analysis tractable as usual, the elastic stiffness, piezoelectric parameter, and dielectric permittivity of FGPMs are assumed to be exponential functions of x parallel to the crack.The boundary conditions on crack surfaces are assumed to be the stress free and electrically impermeable.The high order crack tip stress and electric displacement fields are obtained by the eigen-expansion method.This study possesses fundamental significance as Williams' solution to homogeneous materials.

Source: International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME)

DOI: 10.2991/ic3me-15.2015.335

Authors: Xiao Chong, Yao Dai, Dianhui Hou, Junguo Ma

Institution: PLA Army Engineering University

Language: English

Topic: Elasticity and Wave Propagation

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Funder: National Natural Science Foundation of China

OpenAlex ID: W1160933859