Work

Advance semiconductor package applied on high efficiency dual-mode DC-DC buck converter

Year: 2015

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2015.7236571

Authors: Cheng-Yu Ho, Hung-Hsiang Cheng, Ming-Feng Chung, Chen-Chao Wang, Cing-Wen Yang, Hung-Yu Wang

Institutions: Advanced Semiconductor Engineering (Taiwan), National Quemoy University, National Kaohsiung University of Applied Sciences

Language: English

Topic: Advanced DC-DC Converters

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1482836364

FWCI: 1.665

Cites: 14

Cited by: 7

Related to: 10