Work

Cumulative Thin Film Stress From Wafer Fabrication Processes And Its Effect On Post Backgrind Wafer Shape

Year: 2005

Type: conference-paper

Source: ASMC proceedings

DOI: 10.1109/asmc.1993.682491

Authors: J.L. Kawski, J. Flood

Institution: Motorola (United States)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1486936688

FWCI: 1.169

Cites: 3

Cited by: 2

Related to: 10