Work

Opening the hole of the backside silicon and forming the alloy bump for TSVs

Year: 2015

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2015.7236740

Authors: Dao-wei Wu, Ke-Zhong Li, Guang-Bao Shan, Long-Sheng Wu, Xiao-Qiong Zheng, Yu-Feng Jin

Institution: Peking University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1541464288

FWCI:

Cites: 8

Cited by: 1

Related to: 10