Work

A comprehensive packaging solution for next generation IC substrates

Year: 2011

Type: conference-paper

Source: European Microelectronics and Packaging Conference

Authors: Stephen Kenny, Dave Baron, Bernd Roelfs, Frank Bruening

Institution: Atotech (Germany)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1576282255

FWCI:

Cites:

Cited by: 3

Related to: 10