Work

The intermetallic compound (IMC) growth and phase identification of different kinds of copper wire and Al pad thickness

Year: 2015

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2015.7159782

Authors: Stuwart Fan, Louie Huang, Ming-Chi Ho, Ker-Chang Hsieh

Institutions: Advanced Semiconductor Engineering (Taiwan), National Sun Yat-sen University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1579939751

FWCI: 0.416

Cites: 9

Cited by: 4

Related to: 10