Work

Modular microelectronics by System-in-Packages with embedded components

Year: 2011

Type: conference-paper

Source: Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)

Authors: A. Ostmann, B. Bruehl, D. Manessis, Manuel Seckel, K.-D. Lang

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: Embedded Systems Design Techniques

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1600412040

FWCI:

Cites: 7

Cited by: 2

Related to: 10