Work

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

Year: 2014

Type: conference-paper

Source: International 3D Systems Integration Conference (3DIC)

DOI: 10.1109/3dic.2014.7274306

Authors: Y. Beilliard, T. Signamarcheix, S. Moreau, L. Di Cioccio, P. Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-h. Jouneau, E. Rolland

Institutions: Centre National de la Recherche Scientifique, Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Science et Ingénierie des Matériaux et Procédés, STMicroelectronics (France), Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes, Université Joseph Fourier, Institut Nanosciences et Cryogénie

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Institute of Standards and Technology

OpenAlex ID: W1661007454

FWCI: 4.063

Cites: 11

Cited by: 41

Related to: 10