Work

Electrical and Mechanical Characterization of Mwnt Filled Conductive Adhesive for Electronics Packaging

Year: 2008

Type: article

Source: UKnowledge (University of Kentucky)

Author: Jing Li

Institution: University of Kentucky

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W183781983

FWCI:

Cites: 30

Cited by: 1

Related to: 10