Work

Partly-additive process for manufacturing high-density printed wiring boards

Year: 2003

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1992.204336

Authors: S. Imabayashi, I. Tanaka, H. Kikuchi, M. Watanabe, H. Oka, S. Izumi, Y. Taniguchi, S. Fujita

Institution: Hitachi (Japan)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1908121498

FWCI:

Cites: 4

Cited by: 2

Related to: 10