Work

Failure to short-circuit capability of emerging direct-lead-bonding power module. Comparison with standard interconnection. Application for dedicated fail-safe and fault-tolerant converters embedded in critical applications

Year: 2015

Type: conference-paper

Source: European Conference on Power Electronics and Applications

DOI: 10.1109/epe.2015.7309355

Authors: William Sanfins, Frederic Richardeau, Damien Risaletto, Gael Blondel, Michael Chemin, Philippe Baudesson

Institutions: Centre National de la Recherche Scientifique, Valeo (France), Laboratoire Plasma et Conversion d'Energie, École Nationale Supérieure d'Électrotechnique, d'Électronique, d'Informatique, d'Hydraulique et des Télécommunications

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1925631680

FWCI: 1.249

Cites: 11

Cited by: 4

Related to: 10