Work

Assessing solder interconnect reliability of control boards in power electronic systems using Physics-of-Failure models

Year: 2014

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm.2014.6892410

Authors: David Squiller, Elena Mengotti, Patrick McCluskey

Institutions: University of Maryland, College Park, ABB (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1964178481

FWCI: 0.401

Cites: 17

Cited by: 2

Related to: 10