Work

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Year: 2005

Type: article

Source: Acta Materialia

DOI: 10.1016/j.actamat.2005.01.014

Authors: Y.H. Lin, Y.C. Hu, C.M. Tsai, C.R. Kao, K.N. Tu

Institutions: National Central University, University of California, Los Angeles

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Council

OpenAlex ID: W1964600718

FWCI: 11.37

Cites: 16

Cited by: 150

Related to: 10