Work

Laser ablation of silicon wafer with a water microdrop

Year: 2006

Type: article

Source: Journal of Laser Applications

DOI: 10.2351/1.2193178

Authors: Kouki Shimizu, Kunimitsu Takahashi, Hiroshi Morikazu, Nobumori Ogoshi, Koichi Takeyama, Yoji Wakayama, Tetsuro Obara

Institutions: Disco (japan), Lintec Corporation (Japan), Saitama University

Language: English

Topic: Laser Material Processing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1966149286

FWCI:

Cites: 4

Cited by: 4

Related to: 10