Work

Numerical investigation on the thermal reliability and layout optimisation of printed circuit board level

Year: 2012

Type: article

Source: International Journal of Materials and Structural Integrity

DOI: 10.1504/ijmsi.2012.049963

Authors: Tao Xi, Xingang Yu, Xifu Song, Jian Liu, Xiuwen Yang, Yanfang Zhao, Liqiang Zhang, Ping Yang

Institution: Jiangsu University

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Jiangsu University, Government of Jiangsu Province

OpenAlex ID: W1968167000

FWCI: 3.187

Cites:

Cited by: 7

Related to: 10