Work

High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film

Year: 2004

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.596307

Authors: Gi-Jung Nam, Meong-Hui Seo, Yun-Suk Hong, Sang-Yup Lee, Sung-Wook Moon, Kwang-Hyun Ryu, Nam-Ic Kwon, No-Heung Kwak

Institution: Institute for Advanced Engineering

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1968209690

FWCI: 0.83

Cites:

Cited by: 2

Related to: 10