Year: 1993
Type: editorial
Abstract: packaging and interconnection is evident in the papers presented in the volume.The EEP Division, and more generally ASME, provide a common meeting ground for mutual education and enlightenment.It is hoped that the present collection of papers will stimulate the reader to the challenges and opportunities presented by mechanical and thermal phenomena in electronics packaging.We thank the attendees, reviewers, session chairs, and especially the authors for their suggestions, support, contributions, and cooperation in preparing this issue.It is through their.efforts that our JOURNAL OF ELECTRONIC PACKAGING remains a dynamic and interesting publication.
Source: Journal of Electronic Packaging
DOI: 10.1115/1.2909308
Authors: Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W1968357663