Work

Utilizing plating bar structure to enhance passive equalizer compensation technique

Year: 2014

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2014.6922721

Authors: Chen-Chao Wang, Hung-Chun Kuo, Fu-Chen Chu, You-Le Lin, Tsai-Yun Hsieh, Chi-Tsung Chiu, Chih-Pin Hung, Sheng-Hua Huang, Chih-Wen Kuo

Institutions: Advanced Semiconductor Engineering (Taiwan), National Sun Yat-sen University

Language: English

Topic: Advancements in PLL and VCO Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1968457329

FWCI:

Cites: 8

Cited by: 2

Related to: 10