Work

Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate

Year: 2007

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-007-0285-3

Author: Kenji Monden

Institution: Denka (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1968945472

FWCI: 0.306

Cites: 10

Cited by: 2

Related to: 10