Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive
Year: 2014
Type: article
Abstract: The thermal diffusivity (TD) and thermal conductivity (TC) of Cu–Cr–diamond composite materials were examined in the temperature range from 50 to 300 °C for diamond volume fractions of 22, 40, 50, 55, and 60 %. The samples were fabricated by the plasma pulse sintering (PPS) method. TC does not increase proportionally with the diamond fraction in the particular composite materials. The highest TD was determined for 50 % diamond volume fraction, and the evaluated TC reached 658 W m −1 K −1 at 50 °C. This article complements earlier articles concerning synthesis and characterization of the diamond–copper composites produced by the PPS method.
Authors: Patrycjusz Mańkowski, Adam Dominiak, Roman Domański, Mirosław J. Kruszewski, Łukasz Ciupiński
Institution: Warsaw University of Technology
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $3,790
OpenAlex ID: W1969360810