Work

Solder joint reliability of plastic ball grid array packages

Year: 1999

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/09540919910254930

Authors: Chong Hua Zhong, Sung Yi

Institutions: Advanced Micro Devices (Singapore), Nanyang Technological University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1971028528

FWCI: 7.696

Cites: 10

Cited by: 61

Related to: 10