Work

A study of the thin film on the surface of Sn–3.5Ag/Sn–3.5Ag–2.0Cu lead-free alloy

Year: 2005

Type: article

Source: Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2005.07.050

Authors: Fei-Yi Hung, Hung-Mao Lin, Puo-Sheng Chen, Truan-Sheng Lui, Li-Hui Chen

Institution: National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Council

OpenAlex ID: W1972089402

FWCI: 1.847

Cites: 10

Cited by: 35

Related to: 10