Micro-Compression Testing of TSV Copper Pillar: An In Situ Method and Mechanical Property
Year: 2013
Type: article
Abstract: This paper puts forward an in-situ testing method for the mechanical properties of TSV copper pillar by using micro-compression experiment. The sample for micro-compression test is prepared by the processes as follows: (a) etching TSV with deep reactive ion etching (DRIE), (b) sputtering a layer of Ti/Cu as the seed layer, (c) TSV copper plating technology, and (d) corroding the silicon to obtain the final specimen. The micro compression test is done with a micro-compression system, consisting of a three-dimensional adjustable stage, a microscope, a force sensor, and a piezoelectric motor. The experimental results show that the platform can test TSV copper pillar’s stress, the accuracy is reached mN. The yield strength of TSV copper pillar is about 199.89 MPa.
Source: Advanced materials research
Authors: Ting Gu, Ping Cheng, Hui Ying Wang, Xu Han Dai, Hong Wang, Gui Fu Ding
Institution: Shanghai Jiao Tong University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W1973419782