Work

Evaluation of the interfacial resistance of thin film interconnexions

Year: 1968

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/0026-2714(68)90013-9

Authors: R.T. Galla, H.M. Greenhouse, W.C. Vergara

Institution: Bendix (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1978667387

FWCI: 1.046

Cites: 1

Cited by: 6

Related to: 10