Work

A novel bottom-up Ag contact (30nm diameter and 6.5 aspect ratio) technology by electroplating for 1Xnm and beyond technology

Year: 2011

Type: conference-paper

Source: Technical digest - International Electron Devices Meeting/Technical digest

DOI: 10.1109/iedm.2011.6131509

Authors: Chao-An Jong, Po-Jung Sung, Mei-Yi Lee, Fu-Ju Hou, Kehuey Wu, Ying-Hao Su, Bing-Mau Chen, Chia-Wei Ho, Ren-Jei Chung, Yao-Jen Lee, Wen-Fa Wu, Chenming Hu, Fu-Liang Yang

Institutions: Minghsin University of Science and Technology, National Taipei University of Technology, University of California, Berkeley

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1978971665

FWCI: 1.375

Cites: 3

Cited by: 1

Related to: 10