Work

Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

Year: 2007

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2007-33250

Authors: Qiang Yu, Tadahiro Shibutani, Akifumi Tanaka, Takahiro Koyama, Masaki Shiratori

Institution: Yokohama National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1980718166

FWCI: 4.521

Cites:

Cited by: 15

Related to: 10