Work

Realtime 3D Stress Measurement in Curing Epoxy Packaging

Year: 2007

Type: conference-paper

Abstract: This paper presents a novel method to characterize stress in microsystem packaging. A circularp-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be σxx-σyy=6.7 MPa and (σxx+σyy-0.4σzz)=232 MPa.

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/sensor.2007.4300575

Authors: J. Richter, A. Hyldgard, K. Birkelund, O. Hansen, E.V. Thomsen

Institution: Technical University of Denmark

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W1982913773

FWCI: 1.004

Cites: 3

Cited by: 3

Related to: 10