High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
Year: 2007
Type: conference-paper
Authors: Fubin Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, Stephen Clark
Institution: Hong Kong University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1985456782