Work

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Year: 2009

Type: article

Source: JOM

DOI: 10.1007/s11837-009-0087-6

Authors: K. Nogita, C. M. Gourlay, T. Nishimura

Institutions: The University of Queensland, The University of Osaka, Imperial College London, NIHON SUPERIOR CO., LTD. (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1985807245

FWCI: 8.594

Cites: 22

Cited by: 155

Related to: 10