Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects
Year: 1999
Type: article
Authors: M H Ayliffe, D Kabal, F Lacroix, E Bernier, P Khurana, A G Kirk, F A P Tooley, D V Plant
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1986015006