Work

Investigation of durability of TSV interconnect by numerical thermal fatigue analysis

Year: 2011

Type: article

Source: International Journal of Precision Engineering and Manufacturing

DOI: 10.1007/s12541-011-0076-x

Authors: Sung-Hoon Choa, Cha Gyu Song, Haeng Soo Lee

Institutions: Seoul National University of Science and Technology, Ulsan College

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

Funders: Ministry of Knowledge Economy, Korea Research Council for Industrial Science and Technology

OpenAlex ID: W1990599591

FWCI: 1.734

Cites: 14

Cited by: 30

Related to: 10