Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding
Year: 2012
Type: conference-paper
Authors: A. Phommahaxay, A. Jourdain, G. Verbinnen, T. Woitke, P. Bisson, M. Gabriel, W. Spiess, A. Guerrero, J. McCutcheon, R. Puligadda, P. Bex, A. Van den Eede, B. Swinnen, G. Beyer, A. Miller, E. Beyne
Institutions: IMEC, SUSS MicroTec (Germany), Brewer Science (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Kementerian Pendidikan Nasional
OpenAlex ID: W1990758147