Review of Heat Transfer Technologies in Electronic Equipment
Year: 1995
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.2792113
Author: L. T. Yeh
Institution: Loral (United States)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1990759930