Product
Help
Pricing
About
Jobs
Log in
Get started
Work
Add to collection
Development and Characterization of Sn–Zn–Bi Lead Free Solder
HTML
Details
Locations
Year:
2015
Type:
article
Source:
Transactions of the Indian Institute of Metals
DOI:
10.1007/s12666-015-0517-9
Authors:
S. N. Alam,
M. K. Mishra,
M. Padhy,
A. N. S. S. Swain,
Prerna Mishra,
Ayan Saha
show all 6
Institutions:
National Institute of Technology Rourkela,
Central University of Jharkhand
Language:
English
Topic:
Electronic Packaging and Soldering Technologies
Subfield:
Electrical and Electronic Engineering
Field:
Engineering
Domain:
Physical Sciences
Open Access status:
closed
OpenAlex ID:
W1992845488
FWCI:
0.42
Cites:
30
Cited by:
5
Related to:
10