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Al2O3 and TiO2 Atomic Layer Deposition on Copper for Water Corrosion Resistance

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Year: 2011
Type: article
Source: ACS Applied Materials & Interfaces
DOI: 10.1021/am2009579
Authors: A. I. Abdulagatov, Y. Yan, J. R. Cooper, Y. Zhang, Z. M. Gibbs, A. S. Cavanagh, R. G. Yang, Y. C. Lee, S. M. George
Institutions: Defense Advanced Research Projects Agency, University of Colorado Boulder
Language: English

Topic: Semiconductor materials and devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
SDG: Clean water and sanitation

Open Access status: closed

Funders: National Science Foundation, University of Minnesota, Defense Advanced Research Projects Agency
OpenAlex ID: W1995326391
FWCI: 10.19
Cites: 53
Cited by: 306
Related to: 10
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