Work

A Novel CoWP Cap Integration for Porous Low-WCu Interconnects With NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

Year: 2006

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2006.1648674

Authors: N. Kawahara, M. Tagami, B. Withers, Y. Kakuhara, H. Imura, K. Ohto, T. Taiji, K. Arita, T. Kurokawa, M. Nagase, T. Maruyama, N. Oda, Y. Hayashi, J. Jacobs, M. Sakurai, M. Sekine, K. Ueno

Institutions: NEC (Japan), NEC (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1996352003

FWCI: 2.542

Cites: 1

Cited by: 3

Related to: 10