Work

A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging

Year: 2014

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2014.07.054

Authors: Aldo Ghisi, Stefano Mariani, Alberto Corigliano, Giorgio Allegato, Laura Oggioni

Institutions: Politecnico di Milano, STMicroelectronics (Italy)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W1997673418

FWCI: 0.173

Cites: 15

Cited by: 1

Related to: 10