Magnetic Field Imaging for non destructive 3D IC testing
Year: 2014
Type: article
Source: Microelectronics Reliability
Authors: J. Gaudestad, A. Orozco
Institution: Neocera (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1998402992