Work

Fast 3D tomography at package level by using Xe plasma focused ion beam

Year: 2013

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa.2013.6599137

Authors: T. Hrncir, L. Hladik, M. Zadrazil

Institution: Tescan (Czechia)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1998463295

FWCI:

Cites: 3

Cited by: 2

Related to: 10