Work

Recrystallization Mechanisms in Wire-Drawn Copper

Year: 2004

Type: article

Abstract: Wire-drawn Electrolytic Tough Pitch copper deformed at moderate strain has been investigated with Electron Back Scattered Diffraction in a Scanning Electronic Microscope in order to evaluate the recrystallization mechanisms at the meso-scale. Experimentally, it has been shown that the static recrystallization takes place first in the highly deformed and misoriented areas, in the intermediate regions of the wire. The grains related to the <100> fiber nucleate and grow first in these regions, but some other orientations (including the <111> oriented grains) - that have a combined nucleation/growth potential - develop in second time. The annealing twinning is active from the beginning of the recrystallization and tends to randomize the final recrystallization texture.

Source: Materials science forum

DOI: 10.4028/www.scientific.net/msf.467-470.135

Authors: Ph. Gerber, S. Jakani, Thierry Baudin, Marie Helene Mathon, Richard Penelle

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Paris-Saclay - Etablissement de Saclay, CEA Paris-Saclay, Université Paris-Sud

Language: English

Topic: Metallurgy and Material Forming

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

OpenAlex ID: W1998475550

FWCI: 0.561

Cites: 15

Cited by: 3

Related to: 10