Work

Degradation behavior in upstream/downstream via test structures

Year: 2014

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2014.07.042

Authors: J. Kludt, K. Weide-Zaage, M. Ackermann, V. Hein, C. Kovács

Institutions: Leibniz University Hannover, X-Fab (Germany)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2000366079

FWCI: 0.225

Cites: 6

Cited by: 2

Related to: 10