Work

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Year: 2003

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.1533058

Authors: Haruo Nose, Masao Sakane, Yutaka Tsukada, Hideo Nishimura

Institutions: Osaka Sangyo University, Ritsumeikan University, IBM Japan, Ltd. (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2000372993

FWCI: 3.64

Cites: 4

Cited by: 51

Related to: 10