Work

Low cost Pd coated Ag bonding wire for high quality FAB in air

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6248973

Authors: Suresh Tanna, Jairus L. Pisigan, W. H. Song, Christopher Halmo, John Persic, Michael Mayer

Institution: University of Waterloo

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2000455170

FWCI: 5.718

Cites: 15

Cited by: 26

Related to: 10