Work

Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agents

Year: 1997

Type: article

Source: Journal of Adhesion Science and Technology

DOI: 10.1163/156856197x00921

Authors: S.M. Song, C.E. Park, H.K. Yun, S.Y. Oh, J.M. Park

Institutions: Pohang University of Science and Technology, Samsung Electronics (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2001392467

FWCI: 1.424

Cites: 7

Cited by: 17

Related to: 10