Work

Warpage analysis of layered structures connected by direct brazing

Year: 2011

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2011.07.051

Authors: T. Asada, Y. Yagi, M. Usui, T. Suzuki, N. Ohno

Institutions: Toyota Central Research and Development Laboratories (Japan), Toyota Motor Corporation (Japan), Nagoya University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2002173376

FWCI:

Cites: 12

Cited by: 2

Related to: 10