Work

Micro Channel Vapor Chamber for high heat Spreading

Year: 2008

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2008.4763522

Authors: Yasuhiro Horiuchi, Masataka Mochizuki, Koichi Mashiko, Yuji Saito, Fumitoshi Kiyooka, Gerald Cabusao, Thang Nguyen

Institution: Fujikura (Japan)

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2002197052

FWCI: 1.24

Cites: 5

Cited by: 9

Related to: 10