Three-dimensional chemo-thermomechanically coupled simulation of curing adhesives including viscoplasticity and chemical shrinkage
Work
Year: 2011
Type: article
Source: Computational Mechanics
Institution Universität der Bundeswehr München
Cites: 28
Cited by: 22
Related to: 10
FWCI: 1.919
Citation percentile (by year/subfield): 84.25
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed