Filament scaling forming technique and level-verify-write scheme with endurance over 107 cycles in ReRAM
Year: 2013
Type: conference-paper
Authors: A. Kawahara, K. Kawai, Y. Ikeda, Y. Katoh, R. Azuma, Y. Yoshimoto, K. Tanabe, Zhiqiang Wei, T. Ninomiya, K. Katayama, R. Yasuhara, S. Muraoka, A. Himeno, N. Yoshikawa, H. Murase, K. Shimakawa, T. Takagi, T. Mikawa, K. Aono
Institution: Panasonic (Japan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2003284017