Reaction Engineering of Through-Chip Via Filling for Wafer-Level 3D Packaging
Year: 2007
Type: conference-paper
Authors: D.P. Barkey, J. Callahan, A. Keigler, Z. Liu, A. Ruff, J. Trezza, B. Wu
Institutions: University of New Hampshire, Cubic (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2004120982